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| EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED - 5W EHP-B03LS/UT04-P05/TR Features Feature of the device: small package with high efficiency Typical color temperature: 6500 K. View angle: 130. Typical light flux output: 190lm @ 700mA. ESD protection. Soldering methods: SMT. Grouping parameter: total luminous flux, color temperature. Typical optical efficiency: 38 lm/W. Thermal resistance (junction to lead): 9 K/W. The product itself will remain within RoHS compliant version. Descriptions The series are specially designed for applications requiring higher brightness. LED should mount onto the Aluminum-cored printed circuit board Allowing for cooling. Applications backlighting (illuminated advertising, general lighting) reading lamps (aircraft, car, bus) indoor and outdoor commercial and residential architectural lighting decorative and entertainment lighting signal and symbol luminaries for orientation indication lights (e.g. steps, exit ways, etc.) Materials Items Housing black body(PCB) Reflector Heat Sink Encapsulating Resin Lens Electrodes Die attach Chip Description Heat resistant polymer Heat resistant polymer Copper Silicone resin Heat resistant clear silicone Ag plating copper alloy Silver paste InGaN--Blue Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev. 1.0 Page: 1 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Package Outline Dimensions Notes: 1. Dimensions are in millimeters 2. Tolerances unless dimensions 0.15mm Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev. 1.0 Page: 2 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Maximum Ratings (T Ambient=25C) Parameter Operating Temperature Storage Temperature Junction Temperature Thermal resistance of junction to heat sink Pulse Forward Current Pulse Power Dissipation Symbol Topr Tstg TJ Rth IF Pd Rating -40 ~ +80 -40 ~ +100 125 11 1000 7.5 Unit C C C K/W mA W Electro-Optical Characteristics (T Ambient=25C) Parameter Bin N1 Luminous Flux(1) N2 N3 Forward Voltage(2) Viewing Angle(3) Color Temperature(4) ---VF 21/2 CCT v Symbol Min 130 160 200 6.6 ---4500 Typ. ------------130 6300 Max 160 200 250 IF=700mA 8.0 ---10000 V deg K lm Unit Condition Note. 1. Luminous flux measurement tolerance : 10% 2. Forward Voltage measurement tolerance : 0.1V 3. 21/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 4. CCT bin refer to document "High Power Illumination emitters labeling and binning" of Everlight. Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 3 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Typical Electro-Optical Curves Relative Spectral Distribution IF=700mA, T Ambient=25C 1.0 Forward Voltage vs Forward current T Ambient=25C 7.5 Relative Luminous Intensity 0.8 7.0 0.6 Forward Voltage(V) 450 500 550 600 650 700 750 6.5 0.4 6.0 0.2 5.5 0.0 400 5.0 0 200 400 600 800 1000 Wavelength (nm) Forward Current(mA) Relative Luminous Intensity vs Forward current T Ambient=25C 1.4 Forward Current Derating Curve, Derating based on TJMAX=125C 800 700 600 500 400 300 200 100 Relative Luiminous Intensity 1.0 0.8 0.6 0.4 0.2 0.0 0 200 400 600 800 1000 Forward Current (mA) 1.2 0 0 20 40 60 80 100 Forward Current(mA) Ambient Temperature (C) Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 4 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Typical Representative Spatial Radiation Pattern 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 D egree (2) Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 5 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Label explanation CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Tube Packing Specifications Reel Dimensions Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 6 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Carrier Tape Dimensions: Loaded quantity 500 PCS per reel. 2 4 11.5 24.0 10.4 16 0 59 Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is 0.1mm Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 7 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Reliability Test Items and Results Stress Test Solderability Reflow Thermal Shock Stress Condition Tsol=230, 5sec Tsol=260, 10sec, 6min H110 20min. ' 20sec. 'L40 20min. H100 30min. ' 5min. 'L 40 30min. Ta=85 , RH=85% Ta= 110 Ta= -40 Ta= -40, IF=700mA H85 15min. ' 5min. 'L 40 15min. IF= 225mA, 2min on/off 2000V, Interval:0.5sec 200V, Interval:0.5sec Stress Duration 1 times 3 times 500 Cycles Temperature Cycle High Temperature/Humidity Reverse Bias High Temperature Storage Low Temperature Storage Low Temperature Operation Life 1000 Cycles 1000hours 1000hours 1000hours 1000hours Power Temperature Cycle 500cycles ESD Human Body Model ESD Machine Model 3 times 3 times *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)50% *VF: FORWARD VOLTAGE DIFFERENCE20% Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 8 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR Precautions For Use 1. Over-current-proof Though EHP-B03 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. Storage i. ii. iii. iv. v. vi. vii. Do not open moisture proof bag before the products are ready to use. Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. The LEDs should be used within a year. After opening the package, the LEDs should be kept at 30 or less and 70%RH or less. The LEDs should be used within 168 hours (7 days) after opening the package. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Pre-curing treatment : 605 for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A08 series LED package should be mounted on a metal core printed circuit board (MCPCB) with proper thermal connection to dissipate approximately 1W of thermal energy under 350mA operation. ii. iii. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 9 of 10 Prepared by: Brady Chou EVERLIGHT ELECTRONICS CO.,LTD. EHP-B03LS/UT04-P05/TR 4. Soldering Condition i. Lead reflow soldering temperature profile ii. iii. iv. Reflow soldering should not be done more than two times. While soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board 5. Soldering Iron i. ii. iii. For prototype builds or small series production runs it is possible to place and solder the LED by hand. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. It is recommended to hand solder the leads with a solder tip temperature of 280C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. iv. Be careful because the damage of the product is often started at the time of the hand solder. Everlight Electronics Co., Ltd. Device No. : http://www.everlight.com Prepared date: 08-20-2007 Rev.1.0 Page: 10 of 10 Prepared by: Brady Chou |
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